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<pubDate>Tue, 28 Apr 2026 15:22:11 +0800</pubDate>
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<description>技术与应用</description>
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<title>技术与应用</title>
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<title>技术与应用</title>
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<description>技术与应用</description>
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<title><![CDATA[制造业的底层逻辑：连接器企业如何用四大铁律穿越周期]]></title>
<link><![CDATA[https://conn.big-bit.com/news/405568.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0427/20260427040829896.jpg border='0' /><br />企业之间的竞争，说穿了是企业认知高度和系统性经营管理能力的竞争。今天，当我们把目光投向中国连接器行业，同样会发现——这个正在经历从规模扩张向高质量发展转型的行业，恰恰也需要重温郭士纳为制造业留下的这四条底层逻辑。]]></description>
<pubDate>2026-04-27 15:53:07</pubDate>
<guid><![CDATA[https://conn.big-bit.com/news/405568.html]]></guid>
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<title><![CDATA[在工业自动化和智能家用电器设计中实现支持边缘AI的电机控制]]></title>
<link><![CDATA[https://ic.big-bit.com/news/405527.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0413/20260413035035305.jpg border='0' /><br />AM13E230x MCU过在单个器件中结合使用Arm® Cortex®-M33 CPU和TI TinyEngine™ NPU，能够在实时控制应用中实现预测性故障检测和自适应控制算法。人形机器人和电器设备中的本地AI模型可以根据实际情况持续监测参数并调整性能，而无需云连接或其他分立式元件。]]></description>
<pubDate>2026-04-13 15:24:14</pubDate>
<guid><![CDATA[https://ic.big-bit.com/news/405527.html]]></guid>
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<title><![CDATA[让测试测量的精度再提升]]></title>
<link><![CDATA[https://ic.big-bit.com/news/405526.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0413/20260413031032896.jpg border='0' /><br />高精度数据转换器、放大器、电压基准源及其他模拟集成电路(IC)，旨在以前所未有的准确性捕捉真实世界的信号，如温度、湿度、电压、电流、距离和位置。]]></description>
<pubDate>2026-04-13 15:08:04</pubDate>
<guid><![CDATA[https://ic.big-bit.com/news/405526.html]]></guid>
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<title><![CDATA[2026年，AI将给设计工程软件带来哪些变革？]]></title>
<link><![CDATA[https://ic.big-bit.com/news/405524.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0413/20260413024507460.jpg border='0' /><br />尽管AI在诸多领域实现了爆发式增长，但受半导体行业复杂特性的影响，其在该领域的发展更为循序渐进。]]></description>
<pubDate>2026-04-13 14:42:56</pubDate>
<guid><![CDATA[https://ic.big-bit.com/news/405524.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<title><![CDATA[人工智能产业的技术构架 ]]></title>
<link><![CDATA[https://ic.big-bit.com/news/405523.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0413/20260413023644825.jpg border='0' /><br />人工智能产业的技术构架通常由基础层、技术层和应用层构成。基础层一般由软硬件设施以及数据服务组成。技术层由算法模型、基础框架以及通用技术组成。应用层主要包括应用平台和智能产品。]]></description>
<pubDate>2026-04-13 14:32:52</pubDate>
<guid><![CDATA[https://ic.big-bit.com/news/405523.html]]></guid>
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<title><![CDATA[压敏电阻器市场应用概述]]></title>
<link><![CDATA[https://ic.big-bit.com/news/405522.html]]></link>
<description><![CDATA[压敏电阻器在消费电子，汽车电子，工业控制，其他新兴领域具有广阔的市场机会。]]></description>
<pubDate>2026-04-13 14:24:09</pubDate>
<guid><![CDATA[https://ic.big-bit.com/news/405522.html]]></guid>
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<title><![CDATA[网络接口雷电防护方案探究]]></title>
<link><![CDATA[https://ic.big-bit.com/news/405521.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0413/20260413015848631.jpg border='0' /><br />为探究可应用于网络接口的雷电防护方案，本文设计了片式压敏电阻（MLV）、气体放电管（GDT）分别与瞬态抑制二极管（TVS）串联组合策略，并对各方案的静动态电性进行了测试及分析。]]></description>
<pubDate>2026-04-13 13:55:10</pubDate>
<guid><![CDATA[https://ic.big-bit.com/news/405521.html]]></guid>
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<title><![CDATA[应用于电解水制氢电源的磁元件设计]]></title>
<link><![CDATA[https://mag.big-bit.com/news/405496.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0403/20260403113205315.jpg border='0' /><br />电解水制氢系统由PEM电解槽、制氢电源构成，针对PEM电解槽低电流纹波及宽功率范围工作要求，研制三相交错并联LLC拓扑结构制氢电源。]]></description>
<pubDate>2026-04-03 11:30:17</pubDate>
<guid><![CDATA[https://mag.big-bit.com/news/405496.html]]></guid>
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<title><![CDATA[网络变压器耐压测试技术综述（四）]]></title>
<link><![CDATA[https://mag.big-bit.com/news/405495.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0403/20260403112427450.jpg border='0' /><br />网络变压器作为无源信号隔离元件早已成为通信网络交换设备中的重要接口器件，本文旨在通过阐述网络变压器耐压测试的缘由、基本原理、遵循标准、测试方式等。]]></description>
<pubDate>2026-04-03 11:22:45</pubDate>
<guid><![CDATA[https://mag.big-bit.com/news/405495.html]]></guid>
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<title><![CDATA[功率电感温升电流的计算及其降压变换器中的应用]]></title>
<link><![CDATA[https://mag.big-bit.com/news/405494.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0403/20260403111420575.jpg border='0' /><br />温升电流作为功率电感重要参数， 本文介绍了“封闭式”功率电感的温升电流及交流损耗的计算方法，并给出了降压转换器连续模式下的磁损计算方法以及对应磁损的类Steinmetz方程式。最后针对温升电流在高频工况下的降额应用进行了探讨，可以为相关技术人员提供应用参考。]]></description>
<pubDate>2026-04-03 11:11:45</pubDate>
<guid><![CDATA[https://mag.big-bit.com/news/405494.html]]></guid>
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<title><![CDATA[隔离辅助电源与主驱逆变器应用是电动车高压系统及远矩离续航设计重要举措]]></title>
<link><![CDATA[https://mag.big-bit.com/news/405493.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0403/20260403110105551.jpg border='0' /><br />本文将围绕以下二个方面的新理念与技术问题作研讨。其一是新理念主驱逆变器的核心技术与应用特征及优势与适用于新主驱逆变器的功率模块作分析说明；其二是高压环境下的隔离辅助电源，从应用场景到解决方案进行全面解析，以帮助工程师快速掌握该技术的核心。]]></description>
<pubDate>2026-04-03 10:57:57</pubDate>
<guid><![CDATA[https://mag.big-bit.com/news/405493.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<item>
<title><![CDATA[连接器制造商供应链面临原材料成本高涨的严峻考验]]></title>
<link><![CDATA[https://conn.big-bit.com/news/405451.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0325/20260325033649517.jpg border='0' /><br />当前黄金、白银和铜价出现史无前例的飙升，这不仅直接冲击着连接器制造商的成本结构与定价策略，更考验着其供应链的抗风险能力。]]></description>
<pubDate>2026-03-25 15:34:08</pubDate>
<guid><![CDATA[https://conn.big-bit.com/news/405451.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<title><![CDATA[DesignCon 2026展示了人工智能领域连接器的创新技术和产品]]></title>
<link><![CDATA[https://conn.big-bit.com/news/405450.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0325/20260325025603926.jpg border='0' /><br />DesignCon 2026第26届盛会于2月24日至26日举办。作为行业盛会充分展现了人工智能驱动下技术与产品领域的突破性进展。]]></description>
<pubDate>2026-03-25 14:53:00</pubDate>
<guid><![CDATA[https://conn.big-bit.com/news/405450.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<title><![CDATA[新建设思考兴产业用电连接器标准体系]]></title>
<link><![CDATA[https://conn.big-bit.com/news/405447.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0325/20260325013041632.jpg border='0' /><br />本文在阐述电连接器在新兴产业中应用现状和发展趋势基础上，分析其标准体系建设的必要性。]]></description>
<pubDate>2026-03-25 13:26:40</pubDate>
<guid><![CDATA[https://conn.big-bit.com/news/405447.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<item>
<title><![CDATA[用于数据中心的下一代400Gbps铜缆互连解决方案]]></title>
<link><![CDATA[https://conn.big-bit.com/news/405446.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0325/20260325094752792.jpg border='0' /><br />人工智能（AI）和高性能计算（HPC）工作负载的迅猛增长正在加速数据中心流量的增加，从而迫切需要下一代高带宽互连技术。]]></description>
<pubDate>2026-03-25 09:44:17</pubDate>
<guid><![CDATA[https://conn.big-bit.com/news/405446.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<item>
<title><![CDATA[光纤金属化在连接器领域中的应用]]></title>
<link><![CDATA[https://conn.big-bit.com/news/405444.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0325/20260325093548781.jpg border='0' /><br />本文将阐述光纤金属化的基本原理与主流工艺，探讨光纤金属化在高端连接器中的应用，为光纤金属化连接器的设计优化、生产制造与工程应用提供参考。]]></description>
<pubDate>2026-03-25 09:30:56</pubDate>
<guid><![CDATA[https://conn.big-bit.com/news/405444.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<item>
<title><![CDATA[国内连接器行业如何通过并购提升行业集中度和行业进步]]></title>
<link><![CDATA[https://conn.big-bit.com/news/405437.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0323/20260323121329757.jpg border='0' /><br />全球连接器行业已形成明显的头部集中格局，前三强企业占据半壁江山，而国内连接器行业虽有长足进步，但集中度仍偏低，多数上市企业规模停留在10-20亿元量级。]]></description>
<pubDate>2026-03-23 11:54:52</pubDate>
<guid><![CDATA[https://conn.big-bit.com/news/405437.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<item>
<title><![CDATA[液冷连接器的应用与系统集成创新]]></title>
<link><![CDATA[https://conn.big-bit.com/news/405411.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0313/20260313113134284.jpg border='0' /><br />本文在阐述液冷连接器基础知识以及在新兴产业中应用基础上，分析液冷连接器系统集成创新的必要性。论述其系统集成创新的核心内容、面临挑战与难点。 并对其未来系统集成创新提出希望和建议。]]></description>
<pubDate>2026-03-13 11:25:58</pubDate>
<guid><![CDATA[https://conn.big-bit.com/news/405411.html]]></guid>
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<title><![CDATA[是德科技前瞻：2026年制造业网络安全趋势预测]]></title>
<link><![CDATA[https://ic.big-bit.com/news/405406.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0312/20260312111844129.jpg border='0' /><br />本篇是德科技文章将聚焦制造业领域，具体探讨2026年及未来网络安全的三大核心发展趋势。]]></description>
<pubDate>2026-03-12 11:15:59</pubDate>
<guid><![CDATA[https://ic.big-bit.com/news/405406.html]]></guid>
<author>https://emotor.big-bit.com</author>
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<title><![CDATA[三项由半导体赋能的创新正影响着我们体验世界的方式]]></title>
<link><![CDATA[https://ic.big-bit.com/news/405405.html]]></link>
<description><![CDATA[<img src=https://image1.big-bit.com/2026/0312/20260312105531877.jpg border='0' /><br />更安全的系统、更小型的器件和人工智能的普及，将重新定义未来科技发展。]]></description>
<pubDate>2026-03-12 10:52:41</pubDate>
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